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Electronics Cooling: Chip To Power Plant
Electronics Cooling: Chip to Power Plant Howard L. Davidson, Ph.D. hld@speakeasy.net ARPA-E, March 2012 . Electronics Cooling for moderate power density, is directly into a finned heatsink by conduction. • When the power density is so high that the interface to the heatsink will have too ... Fetch This Document
GS66508T-EVBHB 650V GaN E-HEMT Half Bridge Evaluation Board
GaN E-HEMT Half Bridge Evaluation Board GS66508T, 30A/55mΩ), gate drive power supply, half bridge gate drivers and heatsink. To evaluate the performance of GaN E-HEMT devices in real power circuits, the EVB can be easily configured into any ... Read Full Source
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Genesys 2 Schematics - Digilentinc
F5 heatsink malico mbf31035-24p + sunon mc30101v1-0000-g99 digilent inc. pic101 pic102 coc1 pic202 pic201 coc2 pif10f cof1 genesys 2 h.1 out of 22 2015 gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd gnd ... Return Document
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BGA Cooler For 45 X 45 Mm Chip Set - Farnell.com
BGA Cooler SPECIFICATION No.5, Ming Lung Road ,Yang Mei , Taiwan 32663 website : www.malico.com Model : CEBF0145451601-00 EBF45001-20B Rth 1.3 °C/W ... Read Content
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NOTE: This disposition is nonprecedential. United States Court of Appeals for the Federal Circuit _____ MALICO, INC., Plaintiff-Appellant, ... View Doc
Model Name : MBA29001-15W/2.6 BGA Heat Sink For 29x29 Chip Set
Performance Data: Specification: BGA Heat Sink Model Name : No.5, Min Lung Road, Yang Mei Taiwan, R.O.C. Tel : 886-3-4728155 Fax : 886-3-4725979 E-mail : sales@malico.com.tw ... Fetch Doc
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